In accordance with production process specifications, materials such as copper and substrates are cut and formed—processing raw materials into sheets or other required shapes—to meet the processing requirements of subsequent stages.

Adhesive is applied between adjacent inner layers of a multilayer flexible circuit board to facilitate interlayer bonding, enabling the integrated lamination and adhesion of the inner layers during the subsequent thermal pressing process.

Bonding film is used as the intermediate adhesive medium to assemble and laminate the outer copper foil with the inner circuit layer, ensuring precise alignment and positioning of the functional layers and preparing the assembly for the subsequent multilayer FPC thermal lamination process.

The multi-layer laminated material undergoes lamination and curing to achieve tight bonding between layers, resulting in an integrally formed multi-layer FPC substrate.

A protective film is applied to the copper foil areas of the fabricated circuitry; this film acts as a barrier against external contact, preventing damage, oxidation, or contamination of the circuits during subsequent processing steps.

Lamination is performed under specific temperature and pressure conditions to ensure the protective film bonds tightly with the copper foil bearing circuit patterns, thereby enhancing interfacial adhesion and achieving secure attachment of the protective film.

Enables substrate dehumidification and baking to thoroughly expel internal moisture, ensuring complete curing of the coverlay adhesive layer and reducing process defects such as delamination and blistering.

Substrate alignment holes are produced via a punching process to serve as alignment references for the board; this effectively enhances alignment accuracy in subsequent steps and ensures stable downstream processing.

Printing or inkjet marking operations are performed on the surface of flexible printed circuits (FPCs) to apply characters, model identifiers, polarity markings, and other information, thereby facilitating production identification and finished-product inspection.

Complete the secondary punching and hole-forming of the substrate, producing both process reference holes and shaped holes to meet the requirements for precise alignment in subsequent processes and the shaping of the product's outer profile.

Perform automated electrical performance testing on individual units to accurately determine circuit continuity, assess insulation performance, and detect short-circuit or open-circuit defects, thereby ensuring control over product electrical quality.

Automated visual inspection equipment is used to perform a full-area scan of FPC surfaces, accurately identifying various visual defects—such as broken traces, surface scratches, short circuits, and substrate notches—to screen for product visual quality.

Automated visual inspection equipment is used to perform a full-area scan of FPC surfaces, accurately identifying various visual defects—such as broken traces, surface scratches, short circuits, and substrate notches—to screen for product visual quality.

It automatically peels off the protective film from the auxiliary material, efficiently removing the surface release liner to ensure a clean bonding surface and provide optimal interface conditions for subsequent processes.

Using a stamping and riveting process, riveting operations are performed on FPC terminals and pad areas; a mechanical interlocking structure is created through material deformation, ensuring the secure assembly of components.

Localized contour machining of the substrate is achieved through a secondary punching process, precisely forming specific sections of the product's outer profile and ensuring dimensional accuracy meets assembly requirements.

Equipped with a visual measurement module, the system automatically detects product expansion, contraction, and deformation; it intelligently sorts and classifies products based on actual measurements, effectively controlling dimensional deviations and enhancing dimensional yield and assembly compatibility.

In accordance with production process specifications, materials such as copper and substrates are cut and formed—processing raw materials into sheets or other required shapes—to meet the processing requirements of subsequent stages.

Adhesive is applied between adjacent inner layers of a multilayer flexible circuit board to facilitate interlayer bonding, enabling the integrated lamination and adhesion of the inner layers during the subsequent thermal pressing process.

Bonding film is used as the intermediate adhesive medium to assemble and laminate the outer copper foil with the inner circuit layer, ensuring precise alignment and positioning of the functional layers and preparing the assembly for the subsequent multilayer FPC thermal lamination process.

The multi-layer laminated material undergoes lamination and curing to achieve tight bonding between layers, resulting in an integrally formed multi-layer FPC substrate.

A protective film is applied to the copper foil areas of the fabricated circuitry; this film acts as a barrier against external contact, preventing damage, oxidation, or contamination of the circuits during subsequent processing steps.

Lamination is performed under specific temperature and pressure conditions to ensure the protective film bonds tightly with the copper foil bearing circuit patterns, thereby enhancing interfacial adhesion and achieving secure attachment of the protective film.

Enables substrate dehumidification and baking to thoroughly expel internal moisture, ensuring complete curing of the coverlay adhesive layer and reducing process defects such as delamination and blistering.

Substrate alignment holes are produced via a punching process to serve as alignment references for the board; this effectively enhances alignment accuracy in subsequent steps and ensures stable downstream processing.

Printing or inkjet marking operations are performed on the surface of flexible printed circuits (FPCs) to apply characters, model identifiers, polarity markings, and other information, thereby facilitating production identification and finished-product inspection.

Complete the secondary punching and hole-forming of the substrate, producing both process reference holes and shaped holes to meet the requirements for precise alignment in subsequent processes and the shaping of the product's outer profile.

Perform automated electrical performance testing on individual units to accurately determine circuit continuity, assess insulation performance, and detect short-circuit or open-circuit defects, thereby ensuring control over product electrical quality.

Automated visual inspection equipment is used to perform a full-area scan of FPC surfaces, accurately identifying various visual defects—such as broken traces, surface scratches, short circuits, and substrate notches—to screen for product visual quality.

Automated visual inspection equipment is used to perform a full-area scan of FPC surfaces, accurately identifying various visual defects—such as broken traces, surface scratches, short circuits, and substrate notches—to screen for product visual quality.

It automatically peels off the protective film from the auxiliary material, efficiently removing the surface release liner to ensure a clean bonding surface and provide optimal interface conditions for subsequent processes.

Using a stamping and riveting process, riveting operations are performed on FPC terminals and pad areas; a mechanical interlocking structure is created through material deformation, ensuring the secure assembly of components.

Localized contour machining of the substrate is achieved through a secondary punching process, precisely forming specific sections of the product's outer profile and ensuring dimensional accuracy meets assembly requirements.

Equipped with a visual measurement module, the system automatically detects product expansion, contraction, and deformation; it intelligently sorts and classifies products based on actual measurements, effectively controlling dimensional deviations and enhancing dimensional yield and assembly compatibility.