Solution

FPC Series

Dry process

Preparation of Materials

Stock preparation

Apply bonding adhesive

Apply the outer copper layer

Lamination

Apply a protective film

Electrical measurement

AVI Inspection

Material Patching and Placement

Tear away

Nickel strip riveting

Die-cutting

Expansion and contraction measurement

SMT

Cool down

Lower the board

Automatic return line

Top board

Apply auxiliary materials

Lamination

Die-cutting

Punching and shearing

Production Line Integration and Other Solutions

PCB Series

Copper-embedded solutions

Inkjet Printing Solutions

Cutting Solutions

Fusion-based solutions

Unwinding and Rewinding Solutions

LPF Continuous Die-Cutting Machine RY-LPF1A500

Enables continuous punching and window-opening operations using roll-to-roll feeding for CVL, copper-based substrates, and pure adhesive materials.

Parameters

Enables continuous punching and window-opening operations using roll-to-roll feeding for CVL, copper-based substrates, and pure adhesive materials.

Product Details

Equipment dimensions: 3600 × 800 × 2000 mm

Material width: 250 mm / 260 mm

Working area: 460 × 260 mm (L × W)

Cutting force: 25 T

Material feeding accuracy: ±0.05 mm

Kiss-cutting accuracy: ±0.1 mm

Through-cutting accuracy: ±0.5 mm

Effective feeding distance: 500 mm

Feeding speed: 300 mm/sec

Control system: PLC + HMI

Previous : LPF Continuous Punching 500mm

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