This equipment is used to press the entire product in multiple stages.
This equipment is used to press the entire product in multiple stages.
Key Features:
/ Variable-pitch bonding
/ Real-time pressure monitoring
/ Data upload
Specifications:
/ Working area (mm): 400 x 350
/ Operating temperature: <180°C
/ Operating pressure: ≤100 N
/ Bonding cycle time (CT): 4s/cycle (excluding dwell time, board loading/unloading time, and recognition time)
/ Transport method: Rail + carrier
/ Number of bonding heads: 8
/ Bonding mold dimensions:
Upper mold (min.): 14 x 80 mm
Lower mold (max.): 110 x 259 mm
/ Power supply/consumption: AC 220V, 50Hz, 3 kW
/ Repeatability: ±0.05 mm
/ Weight (kg): ≤900 kg
/ Dimensions (mm) (L x W x H): 1280 x 928 x 1789

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