This equipment is designed based on the protective film punching specifications for the material preparation process of flexible printed circuit boards.

Parameters

This equipment is designed based on the protective film punching specifications for the material preparation process of flexible printed circuit boards.

Product Details

Features:

/ Compatible with QAA, QD, AHC, DHC, and A-type mold structures

/ Enables CVL processing

/ Copper substrate

/ Automated pure adhesive processing

Specifications:

/ Punching force: 25T

/ Product width: 250mm

/ Material feeding accuracy: ±0.05mm

/ Half-cut blade accuracy: ±0.1mm

/ Full-cut blade accuracy: ±0.5mm

/ Cycle time (CT): ≤5s

/ Max. mold size: 310mm (W) × 500mm (L)

/ Effective feeding distance: 500mm

/ Feeding speed: 300mm/sec

/ Equipment dimensions: 3600mm (L) × 800mm (W) × 2000mm (H)

Next : LPF Continuous Punching 500mm

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