Solution

FPC Series

Dry process

Preparation of Materials

Stock preparation

Apply bonding adhesive

Apply the outer copper layer

Lamination

Apply a protective film

Electrical measurement

AVI Inspection

Material Patching and Placement

Tear away

Nickel strip riveting

Die-cutting

Expansion and contraction measurement

SMT

Cool down

Lower the board

Automatic return line

Top board

Apply auxiliary materials

Lamination

Die-cutting

Punching and shearing

Production Line Integration and Other Solutions

PCB Series

Copper-embedded solutions

Inkjet Printing Solutions

Cutting Solutions

Fusion-based solutions

Unwinding and Rewinding Solutions

Vacuum Press / Rapid Press RY-ZYH80

Lamination and bonding process for reinforcing materials (such as FR4, PI, SUS) and base materials.

Parameters

Lamination and bonding process for reinforcing materials (such as FR4, PI, SUS) and base materials.

Product Details

Equipment dimensions: 1580 × 1100 × 1520 mm

Working area: 510 × 610 mm (L × W)

Material thickness: ≤2 mm

Working height: 950 ± 50 mm

Heating temperature: Max. 200°C

Pressure range: 5–25 kgf/cm²

Vacuum pressure: 700–740 mmHg

Operation mode: Single-sided/double-sided lamination (using auxiliary materials)

Weight: Approx. 4000 kg

Control system: PLC + HMI

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