Solution

FPC Series

Dry process

Preparation of Materials

Stock preparation

Apply bonding adhesive

Apply the outer copper layer

Lamination

Apply a protective film

Electrical measurement

AVI Inspection

Material Patching and Placement

Tear away

Nickel strip riveting

Die-cutting

Expansion and contraction measurement

SMT

Cool down

Lower the board

Automatic return line

Top board

Apply auxiliary materials

Lamination

Die-cutting

Punching and shearing

Production Line Integration and Other Solutions

PCB Series

Copper-embedded solutions

Inkjet Printing Solutions

Cutting Solutions

Fusion-based solutions

Unwinding and Rewinding Solutions

Vacuum Press / Rapid Press RY-SK200T

Designed for the process conditions of laminating coverlays onto single- or double-sided boards during FPC manufacturing.

Parameters

Designed for the process conditions of laminating coverlays onto single- or double-sided boards during FPC manufacturing.

Product Details

Equipment dimensions: 1150 × 1550 × 1700 mm

Working area: 600 × 500 mm (L × W)

Material thickness: ≤2 mm

Working height: 1050 ± 50 mm

Heating temperature: Max. 200°C

Hydraulic pressure range: 20–140 kgf/cm²

Operation mode: Single-sided/double-sided lamination (using auxiliary materials)

Weight: Approx. 5000 kg

Control system: PLC + HMI

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