It is primarily used in the manufacturing of rigid-flex PCBs for the copper-layer opening process following laser cutting, as well as in flexible PCB production for the removal of EMI shielding and Mylar release films.

Parameters

It is primarily used in the manufacturing of rigid-flex PCBs for the copper-layer opening process following laser cutting, as well as in flexible PCB production for the removal of EMI shielding and Mylar release films.

Product Details

Equipment dimensions: 2100 × 2200 × 2300 mm

Work platform: 420 × 320 mm (customizable upon request)

Film peeling accuracy: ±0.1 mm

Work head: Single head

Pressure range: 80 N – 240 N

Feeding method: Stack feeding

Product thickness: 0.1 – 0.5 mm

Transfer method: Robotic arm + suction cups

System components: PLC + PC + CCD

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