PRODUCTS
It is applied to the high-precision board bonding of FPC products, with a bonding accuracy of ±0.03mm
It is applied to the high-precision board bonding of FPC products, with a bonding accuracy of ±0.03mm
Product Information
☆ High-precision bonding
☆ Take photos of the materials to correct deviations
☆ Navigation map editing materials
☆ Mounting pressure detection
☆ Automatic scanning, no rework, MES intelligent production, data upload
Basic information
Equipment dimensions: 1550*1800*1720 (L*W*H)
Power supply: AC220V 50Hz
Air pressure: 0.5-0.7 (Mba) Dry air source
Equipment weight: ~2000 KG
Mounting range: 450mm*450mm
Number of nozzles: Double nozzles
Mounting specifications: Min: 1.5*1.5mm/MAX: 50*80mm
Bonding efficiency: 2 seconds/PCS
Bonding accuracy: ± 0.03mm
Material types: Two types of coil materials are supplied
Handling method: Track transmission (5 seconds when entering and leaving the plate)

Copy product links
Long by picture save/share