PRODUCTS
It is applied to the copper embedding process of PCB products
It is applied to the copper embedding process of PCB products
Product Information
☆ High-precision bonding
☆ Sheet material +tray feeding (reserved for coil material application)
☆ Navigation map editing materials
☆ Mounting pressure detection
☆ Automatic scanning, no rework, MES intelligent production, data upload
Basic information
Equipment dimensions: 1550*1800*1720 (L*W*H)
Power supply: AC220V 50Hz
Air pressure: 0.5-0.7 (Mba) Dry air source
Equipment weight: ~3000 KG
Mounting range: 650mm*600mm
Number of nozzles: Double nozzles
Mounting specifications: Min: 1.5*1.5mm/MAX: 60*60mm
Bonding efficiency: 1.5 seconds/PCS
Bonding accuracy: ± 0.05mm
Material types: Two types of coil materials are supplied
Handling method: Track transmission (5 seconds when entering and leaving the plate)

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