Used for processes such as automatic pre-stacking, alignment, and fusion of multilayer PCB products prior to lamination.
Used for processes such as automatic pre-stacking, alignment, and fusion of multilayer PCB products prior to lamination.
Machine dimensions: 4500L x 1700W x 2000H mm
Fusion dimensions: Max: L730mm x W630mm; Min: L400mm x W400mm
Fusion thickness: ≤8mm (Max. 10mm)
Alignment method: CCD visual alignment
Error-proofing function: Automatic inner-layer identification and expansion/contraction control
Number of CCDs: 4
Number of fusion heads: 16 sets (6 sets per long side, 2 sets per short side)
Thermal fusion block dimensions: (5–8)mm x 21mm
Heating range: Ambient temperature to 400°C

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