For applications such as interlayer bonding in the manufacturing process of multilayer PCBs.
For applications such as interlayer bonding in the manufacturing process of multilayer PCBs.
Machine dimensions: 2200L x 1650W x 1800H (mm)
Fusion dimensions: Max: L730mm x W630mm; Min: L450mm x W400mm
Fusion thickness: Core thickness 0.05mm–1.5mm; Stack thickness 0.8mm–8mm
Alignment method: Pin registration
Pin diameter: Φ3.175mm (+0/-0.01mm)
Number of pins: 4
Number of fusion heads: 16 sets (6 sets on each long side, 2 sets on each short side)
Thermal fusion block dimensions: (5–8)mm x 21mm
Heating range: Ambient temperature to 400°C
Exhaust duct diameter: Φ100mm; exhaust volume ≥ 0.3m³/min
Error-proofing: Core layer ID recognition; PP sheet weight verification
Work platform: Dual-platform 'in-feed/out-feed' (front-in/front-out); optional automatic unloading (front-in/rear-out) available

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