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LPF continuous punching 250MM
This equipment is designed based on the punching conditions of protective films in the material preparation project of flexible printed circuit boards
- Parameters
This equipment is designed based on the punching conditions of protective films in the material preparation project of flexible printed circuit boards
Functional features
Construct molds in combination with QAA, QD, AHC, DHC and A
Implement CVL
Copper substrate
Pure rubber automated operation production
Specification parameters
Impact force: 25 tons
Product width: 250mm
Material pulling accuracy: ±0.05mm
Semi-cutting knife accuracy: ±0.1mm
Full cutting knife accuracy: ±0.5mm
Equipment CT: ≤5 seconds
Maximum mold size: 310W×500L
Effective material pulling distance: 500mm
Material pulling speed: 300mm/sec
Device dimensions: 3600mmL*800mmW*2000mmH
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+86-756-6969588
rx@zh-rx.com
No. 200, Pingdong 1st Road, Nanping Science and Technology Industrial Park, Zhuhai City, Guangdong Province
Copyright © Zhuhai Ruixiang Intelligent Technology Co., LTD. All rights reserved. Yue ICP No. 18062816-1
