This equipment is suitable for cooling and dissipating heat from FPC products and fixture boards after they exit the reflow soldering oven.
This equipment is suitable for cooling and dissipating heat from FPC products and fixture boards after they exit the reflow soldering oven.
Features:
/ Supports inline integration with other equipment;
/ Temperature range: 0°C – 150°C;
/ Temperature monitoring and verification: carriers with temperatures below the set threshold are automatically returned;
/ Uses precision gear direct drive for high transmission accuracy and long service life;
/ Real-time display of cooling time, number of carriers being cooled, and their respective tier levels, enabling visual management;
/ Supports automatic width adjustment and records the height used for each product.
Specifications:
/ Equipment dimensions: 620 x 1550 x 1700 + 500 mm (conveyor extension)
/ Temperature accuracy: ±2°C
/ Configuration: Single-frame unit; 12 or 18 tiers
/ Transport method: Rail + carrier
/ Feeding method: Inline connection with rail conveyor
/ Material dimensions: Max. 350 x 450 x 20 mm (fixture plate)
/ Air pressure: 0.6 MPa (dry air supply)
/ Electrical specifications: 380V/220V
/ Cycle Time (CT): 4 min/unit

Copy product links
Long by picture save/share

