This equipment is used in the electronic soldering process for PCBs.
This equipment is used in the electronic soldering process for PCBs.
Key Features: Utilizes digital control printing technology; imports solder mask CAM data into the system to jet solder mask ink directly onto PCBs and FPCs via high-precision imported piezoelectric printheads; features UV-LED curing for instant drying upon jetting.
Machine Dimensions: 2500mm x 1500mm x 1600mm (L x W x H)
Maximum Board Size: 730mm x 630mm
Alignment Accuracy: ±10μm
Cycle Time (CT): Single-sided: 120 panels/h; Double-sided: 230 panels/h
Air Pressure: 0.5–0.7 MPa
Electrical Specifications: AC 220V

Copy product links
Long by picture save/share

