Second-generation PTP (New Style)

Key Features:

1. Compatible with 5 production modes to meet diverse process requirements;

2. Modular vacuum carrier design enables rapid product type (part number) switching;

3. Compact internal structure results in the smallest footprint for its functional class, minimizing workshop space usage;

4. Includes a cleaning function for high-temperature boards prior to the placement process, improving downstream yields.

Specifications:

1. Dimensions: 1200 x 1500 x 1650 mm (L x W x H)

2. Operating Modes: 1. Bypass mode; 2. A-to-B transfer mode; 3. B-to-C transfer/dispensing/laser mode; 4. Dispensing/laser mode (Station C); 5. Stiffener addition/removal mode

3. High-temperature board dimensions: Length: 250–400 mm; Width: 200–350 mm

4. Working height: 910 mm ± 50 mm

5. Equipment accuracy: ±0.05 mm

6. Power supply: AC 220V, ≤4.5 kW

7. Air supply: 0.5–0.7 MPa (dry air source)

8. Equipment weight: Approx. 1500 kg

9. Cycle Time (CT): ≤16s (varies by operating mode)