PRODUCTS
This equipment is based on the post-processing of flexible printed circuit boards, handling the pre-lamination and false lamination with cover film before bonding
This equipment is based on the post-processing of flexible printed circuit boards, handling the pre-lamination and false lamination with cover film before bonding
Functional features
Compatible with flexible circuit boards and long-sized/large-sized flexible circuit boards in the automotive industry
The continuous pseudo-output of /RTR is used
Specification parameters
Working dimensions: 300*1200mm
Heating temperature: max140℃
Bonding efficiency CT: 18S/PCS
Feeding method: Single column RTR 260mm/520mm
Equipment dimensions: 3680*1000*1760mm
Material pulling accuracy: ±0.05mm

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