Perform unloading operations on FPCs that have completed the SMT process: remove the products from the carriers, smoothly transfer and place them onto trays, and organize the materials according to specifications to facilitate transport to subsequent processes.

An overhead logistics line facilitates the reverse transport of empty SMT carriers, returning them from the unloading point to the board-loading station for continuous supply to the upstream loading process; this establishes a closed-loop circulation for the carriers and optimizes material flow efficiency on the production line.

Individual FPC units are systematically placed into dispensing process carriers to ensure precise positioning, thereby establishing a stable processing reference for subsequent dispensing operations.

It supports the automatic application of various auxiliary materials—such as PSA (pressure-sensitive adhesives), TSA (thermosetting adhesives), QR code labels, and foam—ensuring precise placement and consistent positional accuracy.

Pressure bonding is employed to compress various auxiliary materials attached to the FPC surface, eliminating bubbles at the bonding interface, enhancing adhesion between the auxiliary materials and the substrate, and ensuring stable fixation.

Complete the secondary punching and forming operation for the substrate, precisely cutting specific external contours to ensure dimensional accuracy.

A punch-cutting process is employed to cut the connected substrate panels, separating the FPC strips into individual finished units while ensuring dimensional accuracy.

The holes are punched again to produce standard reference holes, balancing the requirements for precise alignment in subsequent processes and product forming, while ensuring stable dimensional accuracy of the hole locations.

Rapidly identify, divert, and reject defective products while precisely and orderly stacking qualified FPC units onto trays, thereby automating the collection of good parts and enhancing the level of sorting automation.

Perform precision bending on the FPC in accordance with product assembly design requirements, shaping the flexible circuit board into the specified spatial configuration.

Perform functional testing on finished products to comprehensively verify all electrical performance specifications and confirm that the product's electrical performance meets design standards.

Implement AVI (Automatic Visual Inspection) to perform full-area image scanning and comparison on finished FPCs, comprehensively screening for various visual defects to ensure the product is free from cosmetic flaws.

Automated packaging equipment is used to neatly package and protect qualified finished products in accordance with packaging specifications, preventing issues such as scratches or contamination during transit and completing the necessary preparations prior to shipment.