Based on platform-based, workstation-style automation, featuring in-depth R&D and design, and covering full-functionality and full-scope applications.
Based on platform-based, workstation-style automation, featuring in-depth R&D and design, and covering full-functionality and full-scope applications.
Features:
/ Platform-based modular workstation
/ Advanced R&D and design
/ Comprehensive functionality
/ Wide range of applications
Specifications:
/ Dimensions: 3400 x 1250 x 1920 mm
/ Power Supply: 3-phase, 5-wire, 380V, 20 kW
/ Air Supply: 0.6 MPa (dry air source), 1500 L/min
/ Equipment Weight: 3800 kg
/ Bonding Range: Material ≤ 460 x 260 mm; Product width ≤ 260 mm
/ Bonding Temperature: Bonding platform max. 130 ± 5°C; Bonding head max. 85 ± 5°C
/ Pressing Structure: Press head size: 500 x 290 mm; Max. pressure: 2200 kg
/ Pressing Temperature: Upper and lower pressing platforms max. 130°C
/ Pressure Components: Sensor nominal pressure 5T; display resolution 1 kg
/ Pressure Monitoring: Pressure output available; frequency 0.5 s/cycle
/ Pressing Efficiency: < 12 s/pc
/ Placement Accuracy: ± 0.1 mm
/ Board Transport: Tray loading/unloading
/ Product Specifications: 274 x 324 mm
/ Correction System: EPC automatic correction

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