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Multi-layer board with vertical adhesive on both sides BS530
This equipment is used for bonding BS materials in the flexible circuit board manufacturing process
- Parameters
This equipment is used for bonding BS materials in the flexible circuit board manufacturing process
Functional features
Vertical double-sided bonding
Uniform rolling
Foreign object prevention
Specification parameters
Working dimensions (mm) : 500*250
Working head: Double-headed, double-sided
Suitable material types: Membrane type BS
Equipment accuracy: 0.03mm
Mounting accuracy/efficiency: ±0.075mm (excluding product expansion and contraction), 40 seconds per Sheet
Transmission method: roll-to-roll
Feeding method: Coil material + suction and stripping
Energy consumption/Power supply: AC380V/ 3.5KW
Air pressure: 0.5 to 0.7Mpa
Weight (Kg) : <5000
Dimensions (mm) (L*W*H) : 3150*1900*2090
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+86-756-6969588
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No. 200, Pingdong 1st Road, Nanping Science and Technology Industrial Park, Zhuhai City, Guangdong Province
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