Solution

FPC Series

Dry process

Preparation of Materials

Stock preparation

Apply bonding adhesive

Apply the outer copper layer

Lamination

Apply a protective film

Electrical measurement

AVI Inspection

Material Patching and Placement

Tear away

Nickel strip riveting

Die-cutting

Expansion and contraction measurement

SMT

Cool down

Lower the board

Automatic return line

Top board

Apply auxiliary materials

Lamination

Die-cutting

Punching and shearing

Production Line Integration and Other Solutions

PCB Series

Copper-embedded solutions

Inkjet Printing Solutions

Cutting Solutions

Fusion-based solutions

Unwinding and Rewinding Solutions

Lower Platen Mechanism PD-DM372

Used to remove the FPC from the carrier and place it into a tray.

Parameters

Used to remove the FPC from the carrier and place it into a tray.

Product Details

Equipment Dimensions: 1500 × 1500 × 1800 mm

Equipment Precision: ±0.05 mm

Carrier Specifications: SMT carrier (L160 × W220 to L350 × W370)

Tray Specifications: L160 × W220 to L350 × W370

Cycle Time: ≤16s (single-sided); 24s (with flipping)

Conveying Method: Synchronous belt conveyor

Feeding Method: Trays/magazines

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