Solution

FPC Series

Dry process

Preparation of Materials

Stock preparation

Apply bonding adhesive

Apply the outer copper layer

Lamination

Apply a protective film

Electrical measurement

AVI Inspection

Material Patching and Placement

Tear away

Nickel strip riveting

Die-cutting

Expansion and contraction measurement

SMT

Cool down

Lower the board

Automatic return line

Top board

Apply auxiliary materials

Lamination

Die-cutting

Punching and shearing

Production Line Integration and Other Solutions

PCB Series

Copper-embedded solutions

Inkjet Printing Solutions

Cutting Solutions

Fusion-based solutions

Unwinding and Rewinding Solutions

Implemented Vehicles

Suitable for full-panel dispensing in FPC assembly processes and for use as reflow soldering carriers.

Parameters

Suitable for full-panel dispensing in FPC assembly processes and for use as reflow soldering carriers.

Product Details

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No. 200 Pingdong 1st Road, Nanping Science and Technology Industrial Park, Zhuhai City, Guangdong Province

Phone number: +86-756-6969178

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