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High-Precision Heated Reballing Machine AP50

    This equipment is used for board loading in the PCB manufacturing process.

  • Parameters

    This equipment is used for board loading in the PCB manufacturing process.

Equipment Features: Tray-based feeding

Working Area (mm): 420 × 350

Material Size (mm): 10 × 10 – 40 × 40

Bonding Heads: 2 sets; platform heating <80°C, head heating <180°C

Pressure Monitoring: 500g – 5kg

Compatible Materials: FPC (individual pieces), 2D/3D modules

Equipment Precision: 0.02mm

Placement Accuracy/Efficiency:

4-point Mark High-Speed Mode: ±0.1mm, 1 sec/pc (excluding material expansion/shrinkage)

Single-point Alignment High-Precision Mode: ±0.05mm, 1.5 sec/pc (optimal conditions)

Transfer Method: Robotic arm + vacuum suction cup

Feeding Method: Tray / Conveyor belt

Power Consumption/Supply: AC 220V, 4.7kW

Air Pressure: 0.6 MPa

Weight (kg): 1500

Dimensions (mm) (L × W × H): 1690 × 1120 × 1510


High-Precision Heated Reballing Machine AP50
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Phone number: +86-756-6969178 

Copyright© 2026 珠海锐翔智能科技股份有限公司 版权所有 粤ICP备18062816号-1

Copyright© 2026 珠海锐翔智能科技股份有限公司 版权所有 粤ICP备18062816号-1

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