This equipment is used for board loading in the PCB manufacturing process.
This equipment is used for board loading in the PCB manufacturing process.
Equipment Features: Tray-based feeding
Working Area (mm): 420 × 350
Material Size (mm): 10 × 10 – 40 × 40
Bonding Heads: 2 sets; platform heating <80°C, head heating <180°C
Pressure Monitoring: 500g – 5kg
Compatible Materials: FPC (individual pieces), 2D/3D modules
Equipment Precision: 0.02mm
Placement Accuracy/Efficiency:
4-point Mark High-Speed Mode: ±0.1mm, 1 sec/pc (excluding material expansion/shrinkage)
Single-point Alignment High-Precision Mode: ±0.05mm, 1.5 sec/pc (optimal conditions)
Transfer Method: Robotic arm + vacuum suction cup
Feeding Method: Tray / Conveyor belt
Power Consumption/Supply: AC 220V, 4.7kW
Air Pressure: 0.6 MPa
Weight (kg): 1500
Dimensions (mm) (L × W × H): 1690 × 1120 × 1510

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