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Assembly lamination - AX525-3DS 3D Material Lamination machine
It is applied in FPC lamination, motherboard, automotive and other assembly. Screwing, bonding, inserting, gluing, plating, etc. The equipment adopts a gantry structure and can be fine-tuned in terms of feeding and head modules according to customer requirements to achieve various functions.
- Parameters
It is applied in FPC lamination, motherboard, automotive and other assembly. Screwing, bonding, inserting, gluing, plating, etc. The equipment adopts a gantry structure and can be fine-tuned in terms of feeding and head modules according to customer requirements to achieve various functions.
Product Information
☆ 3D material bonding for vehicles
☆ Take photos of the materials to correct deviations
☆ Navigation map editing materials
☆ According to the customer's materials, multiple feeding methods can be adjusted and switched
☆ Automatic scanning, no rework, MES intelligent production, data upload
Basic information
Equipment dimensions: 900*1300*1450(L*W*H)
Power supply: AC220V 50Hz
Air pressure: 0.5-0.7 (Mba) Dry air source
Equipment weight: ~1300 KG
Mounting range: 500mm*300mm
Number of nozzles: Double nozzles
Mounting specifications: Min: 5*5mm/MAX: 30*80mm
Bonding efficiency: 1.2 S/PCS
Bonding accuracy: 0.2mm
Material types: 3 types of TRAY feeding (with reserved space for switching between multiple feedings)
Handling method: Track transmission (5 seconds when entering and leaving the plate)
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