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AP50-FS/TS

    Equipment Application

    AP50-FS: DAF, HAF, TSA, and PSA placement

    AT50-TS: Mounting of PCBs, flex circuits, glass substrates, and 2D/3D components


  • Parameters

    Equipment Application

    AP50-FS: DAF, HAF, TSA, and PSA placement

    AT50-TS: Mounting of PCBs, flex circuits, glass substrates, and 2D/3D components


Equipment Functions

Material pick-up & alignment correction, intermediate positioning, simultaneous pick-and-place, material code reading, product code reading, stationary & on-the-fly imaging, thermal-pressure profiling, independent heating vacuum support stage, heated nozzle, laser height measurement, MES data integration, precision self-check, film peeling (optional)

Specifications

Feeding Method

(AP50‑FS): Peel-off feeder (reel/tape)

(AP50‑TS): Tray feeding (automatic tray loading/unloading)

Conveyor Track

(AP50‑FS): Clamping track for placement, <300mm × 140mm

(AP50‑TS): Return track width, <300mm × 140mm

Placement Head

2 sets; head heating <180°C; pressure control 2–50N

Placement Support Stage

2 sets; preheating zone <80°C; placement zone <180°C; pressure monitoring 2–80N

Equipment Precision

±3μm, CmK > 1.33

Placement Accuracy

(AP50‑FS): ±50μm, CPK > 1.33 (High-speed mode)

(AP50‑TS): ±25μm, CPK > 1.33 (High-precision mode)

Placement Efficiency

(AP50‑FS): 0.85 sec/unit (High-speed mode)

(AP50‑TS): 1.2 sec/unit (High-precision mode)

Material Dimensions (mm)

(AP50‑FS): 1–60mm; thickness 0.05–5mm

(AP50‑TS): 1–60mm; thickness 0.05–10mm

Power Supply: AC 220V, 4.7kW

Air Pressure: 0.6MPa

Weight: 1800kg

Dimensions (mm)

L × W × H: 1120 × 1690 × 1510


AP50-FS/TS
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No. 200 Pingdong 1st Road, Nanping Science and Technology Industrial Park, Zhuhai City, Guangdong Province

Phone number: +86-756-6969178 

Copyright© 2026 珠海锐翔智能科技股份有限公司 版权所有 粤ICP备18062816号-1

Copyright© 2026 珠海锐翔智能科技股份有限公司 版权所有 粤ICP备18062816号-1

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