Equipment Overview: This machine is designed for the placement of thermosetting adhesive materials during the FPC manufacturing process. It features a welded steel frame structure, an independent X-axis platform, and a Y-axis tracking placement mechanism. It utilizes a dual-vision positioning system (featuring Hikvision cameras with 2-megapixel resolution for both top and bottom views) to capture images 'on the fly,' enabling real-time positioning and alignment during placement. Components are transported via robotic vacuum grippers, and the system includes independent left and right board feeding units (capable of interfacing with upstream equipment for in-line operation).
Equipment Overview: This machine is designed for the placement of thermosetting adhesive materials during the FPC manufacturing process. It features a welded steel frame structure, an independent X-axis platform, and a Y-axis tracking placement mechanism. It utilizes a dual-vision positioning system (featuring Hikvision cameras with 2-megapixel resolution for both top and bottom views) to capture images 'on the fly,' enabling real-time positioning and alignment during placement. Components are transported via robotic vacuum grippers, and the system includes independent left and right board feeding units (capable of interfacing with upstream equipment for in-line operation).
Specifications
Compatible Materials: EMI/SUS
Dimensions: 1780 x 2100 x 1800 mm (L x W x H)
Power Supply: AC 220V, 6.5 kW
Air Supply: 0.6 MPa (dry air source)
Equipment Weight: 2100 kg
Placement Area: 310 mm x 610 mm
Placement Nozzles: 2 units
Placement Specifications: Standard range: Max 60 x 150 mm, Min 2 x 2 mm (other sizes subject to testing)
Material Specifications: Inner diameter: 3 or 6 inches; Width x Outer diameter: ≤180 x 230 mm
Heating Method: N/A
Bonding Efficiency: Bonding <1s/pc (actual performance depends on product and materials); Inspection <0.3s/pc
Bonding Accuracy: ±0.05 mm (based on standard film reference)
Repeatability: ±0.005 mm
Board Transfer Efficiency: 3s/cycle
Board Transfer Method: N/A

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